Top solder paste
If you looking for solder paste then you are right place. We are searching for the best solder paste on the market and analyze these products to provide you the best choice.
Best solder paste
1. SRA Soldering Products Rosin Paste Flux #135 In A 2 oz Jar
Feature
The ideal flux for electrical and electronic repairsContains 2 ounce in a "hockey Puck" jar
Formulated for use with tin/lead and lead-free alloys
Description
This petroleum/rosin contains NO Zinc Chloride or Ammonium Chloride, making it a better choice for electronic repairs. Rosin leaves a protective coating over soldered area once job is finished2. MG Chemicals - 8341-10ML 8341 No Clean Flux Paste, 10 milliliters Pneumatic Dispenser (Complete with Plunger & Dispensing Tip)
Feature
Superior fluxing abilityInstant wetting
After soldering, the rosin residue is non corrosive, non conducting, moisture resistant, and fungus resistant
Compatible with lead free and leaded solder systems
Thixotropic paste; RoHS compliant
Description
No Clean Flux Paste. Convenient syringe dispenser ideal for touch up and repair of surface mount assemblies. A unique mixture of high grade synthetic resin and thixotropic agents designed specifically for use with high temperature lead free and conventional Sn/Pb alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Flux paste is a no clean formulation therefore the residues do not need to be removed for most applications. Excellent wettability, no clean, non-conductive, non-tacky residues, compatible with lead free and leaded solder systems, thixotropic paste and RoHS compliant. RoHS compliant.3. No Clean Lead Free Low Temperature Solder Paste 15 Grams
Feature
Low Melting Point Solder PasteT4 new industry standard
Contains Silver for less brittle joint
137C 278F Melting Point (Eutectic)
Two dispensing tips 16g and 20g
4. No Clean SnPb Leaded Solder Paste 15 Grams
Feature
Leaded Solder PasteT4 new industry standard
183C 361F Melting Point (Eutectic)
Two dispensing tips 16g and 20g
63Sn37Pb
5. Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F
Feature
Solder PasteLead Free / RoHS
No Clean
Syringe
Low Temprature
Description
Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F eutectic. Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Size: 5cc/15g syringe6. Solder Paste in jar 50g (T3) Sn63/Pb37 no clean
Description
Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.7. CHIP QUIK SMD291AX REWORK SOLDER PASTE 5CC 63/37 NO CLEAN SOLDER
Feature
Solder PasteLeaded
No Clean
Syringe
Description
Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip.Metal Content: 88% metal by weight.Particle Size: T3 (25-45 microns)Size: 5cc/15g syringe8. Chip Quik Electronic Grade Solder Paste - 63/37 No Clean Flux
Feature
Solder PasteLeaded
No Clean
Jar
Description
Solder Paste in jar 250g (T3) Sn63/Pb37 no clean 90.25% metal.Metal Content: 90.25% metal by weight.Particle Size: T3 (25-45 microns)Size: 250g jar9. Kester EP256 Solder Paste, No-Clean 63/37, Syringe Dispenser (1)
Feature
Packed as pictured. 8cc syringe contains 35 grams of solder pasteKit Includes five 19-gauge dispensing tips (0.033" inside diameter)
63/37 Tin/Lead, the most common for electronics work
No-clean flux formula
Description
Legendary Kester Solder in a convenient Dispense-Pak Saves You Money!
35 gram syringe - includes bonus dispensing tips
Kester EP 256 is a paste solder developed for high volume SMT reflow soldering. It is a no-clean solder paste specifically designed for maximum robustness in reflow profiling. EP256 has the widest possible reflow processing window.
Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue is safe to be left on the assembly after soldering.
Features:
* Kester EP256 63/37 Tin/Lead, the most common for electronics work
* Packed as pictured. 8cc syringe contains 35 grams of solder paste
* Kit Includes five 19-gauge dispensing tips (0.033" inside diameter)
* Stable wetting behavior over a wide range of profiles
* Excellent solderability to a wide variety of metals
* No-clean flux formula. Residues don't need to be removed for typical applications
* Flux residue is non-corrosive and non-conductive
* Stored in refrigeration until shipment
* Factory fresh, NOT SURPLUS. Shipped in labeled package with date code. Shelf life 6mos from DOM
Warnings and cautions:
* For industrial use only
* Repacked from a bulk package. Product is guaranteed to be as labeled
* We can not offer application advice. For use by experienced electronics technicians
* User assumes all risk for application. Warrantees are limited to replacement or refund of product.
* Always wear safety glasses when working with soldering equipment and materials
* Always use adequate ventilation when working with soldering equipment and materials
* Avoid breathing flux fumes emitted during soldering. Flux fumes may cause pulmonary irritation or damage.
* This product may contain chemicals known to the state of California to cause cancer and/or other reproductive harm.
10. Solder Paste in jar 50g (T3) SAC305 no clean
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